Excellent thermal resistance and thermal conductivity
Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
Stable homogeneous mixture
RoHS and REACH Compliant
Highly resistant to pump-out even in vertical applications
Excellent thermal performance at variable Bond Line Thickness (BLT) Thick or Thin
ShinEtsu
ShinEtsu X-23-8117
ShinEtsu X-23-8117：：
- Shin-Etsu’s X-23-8117 product offering is a thermal interface material developed and manufactured with ease of application in mind.
- Specifically formulated to include an application chemical optimized for screen printing and other application techniques, X-23-8117 outperforms in high volume manufacturing environments.
- With high Thermal Conductivity coupled with low Thermal Resistance, this product often exceeds thermal management requirements of high-performance semiconductor devices.
- Through superior heat dissipation, X-23-8117 allows electronic devices to remain cooler and increases long-term reliability.
Features
Typical Properties
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