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HZS

Dowsil

Dowsil TC-4515


Dowsil TC-4515：

  • DOWSIL™ TC-4515 Thermally Conductive Gap Filler is a soft and compressible material once cured, designed to dissipate the heat from electronics mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission
    control unit.

    • This material is specifically designed for a smooth assembly process line integration ideally suited for automated dispensing with meter mix equipment.

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    Features

      • Room temperature cure or heat accelerated cure

      • Long term performance stability during temperature cycling up to 150ºC

      • Holds vertical position (cured or uncured state)

      • UL 94 V-0 and CTI ≥ 600 certifications

      • Glass Beads option (180 & 250 micron)

      • Cost-effective fast cure

      • Easy processing

      • Effective assembly

    Typical Properties

    Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

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    Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.

    Get in touch

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