Flowable heat cure
Low void formation after cure for sensitive substrates
High tensile strength
No added solvents
No mixing required
Rapid, versatile cure processing controlled by temperature
Able to flow, fill or self-leveling after dispensing
Superior sealing achieved with very low voiding
Dowsil
DOWSIL™ 3-1598 HP Adhesive
DOWSIL™ 3-1598 HP Adhesive:
- DOWSIL™ 3-1598 HP Adhesive is suitable for sealing lids and housings, attaching baseplates, gasketing, connector sealing, engine control, ABS, transmission, and lighting applications.
Features
Typical Properties
Looking for additional technical specifications. Download a Product Datasheet in our Resource Library or talk with our technical experts.
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