One-component adhesive/sealant
Cures at room temperature when exposed to moisture in the air
Alkoxy cure system
Non-sag, paste consistency
Easy to apply
Low modulus for high movement capability
Good adhesion to many substrates
Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
Dowsil
DOWSIL™ 7093 Adhesive Sealant
DOWSIL™ 7093 Adhesive Sealant:
- General industrial sealing and bonding applications where non-corrosive cure is, required.
Features
Typical Properties
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