DOWSIL™ 3145 RTV one-part moisture cure adhesives are generally cured at roomtemperature and in an environment of 30 to 80 percent relative humidity eliminating theneed for curing ovens and the associated costs of energy and capital. Greater than 90percent of full physical properties should be attained within 24 to 72 hours and variesaccording to product. Faster manufacturing through-put can be achieved since the adhesiveand component can be handled in much shorter times of about 10 to 120 minutes,depending on the adhesive selected and the amount applied.
● Sealing openings in modules and housings
● Adding mechanical stability to individual components
● Assembly of components on PWBs
● Sealing in and around wired and electrical leads
● Yoke assembly
● Non-flowing
● Room temperature cure
● High tensile strength and elongation
● Enhanced thermal stability
● MIL-A-46146 Group II/III, TY I
● No mixing required
● RT cure, no ovens required
● aster in-line processing with optional heat acceleration
● Can be considered for uses with Mil Spec requirements
● Can be considered for uses needing special high temperature stability
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