Cemedine

Cemedine EP-001K


Cemedine EP-001K:

  • Applications requiring elastic bonding
  •  Adhesion of dissimilar materials with large differences in linear expansion coefficients
  • Adhesion of vibrating parts and places with large stress changes.
  • Adhesion of parts with large internal deformation due to environmental changes such as cooling and heating cycles.

Features

    • The cured film is flexible and tough.

    • Shows high peel adhesion.

    • Good adhesion to various materials including engineering plastics.

    • Little change in physical properties due to temperature changes.

Typical Properties

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