Brand

Momentive SilCool TIA241GF：

• SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices.

• Its non-slumping pasty consistency offers physical stability that can allow improved processingan allow improved processing
• SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications.